Program Description
TANMS offers a unique opportunity for undergraduate students at our six campuses to be part of a dynamic research center focused on understanding new electromagnetic approaches in the development of nanoscale systems in memory, antennas, and motors. URP research participants work collaboratively in diverse teams of three undergrads with the support of graduate or postdoc mentors. Mentors guide each research team assigned to a TANMS lab in carrying out a project related to the Center's cutting-edge multiferroics nanoscale research. Research participants also engage in a range of skill-building activities to support academic success. Through the URP and other educational programs of the center, TANMS aims to prepare the next generation of innovative engineering scientists, industrial leaders, and entrepreneurs.

TANMS URP participants...
  • Acquire real-world research experience working in TANMS advanced engineering testbeds
  • Work in diverse teams oriented by a TANMS postdoc or graduate student mentor
  • Interact with TANMS faculty and research teams across all TANMS institutions
  • Hone ability to present new ideas and scientific research to diverse audiences
  • Gain exposure engineering Industry, Intrapreneurship & Entrepreneurship
  • Build new academic and professional networks


  • Current undergraduate student at a TANMS campus where URP is being offered: UCLA, CSUN, UCB, Northeastern, UT Dallas
  • Must be U.S. Citizen or Permanent Legal Resident
Participant Benefits
  • $1200 stipend (eligibility to receive stipend payment may be affected by the student's financial aid packages)
  • Experience in cutting-edge multiferroics nanoscale research
  • Exposure to related industries & entrepreneurship

  • Engagement in community & skill-building activities
  • Access to workshops, seminars & special events
2021 Program Dates and Locations

Application and Notification

Application Window: November 1 to December 31, 2020
for all partner campuses CSUN, NEU, UCB, UCLA, UT Dallas

Notifications will be sent by Friday January 22, 2021
Program commitments due January 29, 2020